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What Others Say About
SILICON PROCESSING FOR THE VLSI ERA – Vol. 4 |
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| "This is the first book written exclusively on deep-submicron device structures & technology" ... "Stanley Wolf has a unique ability to read the literature & compile relevant information in an understandable format for others to digest. This "integration" of material from over 900 References & its presentation in a coherent way form the primary-value of this book."
"Perhaps one of the more-unique topics covered is Cu-interconnect technology. Wolf's coverage is far-greater than in any other book now in print." |
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| "This well-written reference book is highly-recommended to those interested in the methods used to manufacture deep-submicron MOSFETs. It also the latest in an excellent Series."
"The first chapter nicely identifies several practical problems that appeared during the evolution of the MOSFET to ULSI, and the remainder of the book discusses the latest process solutions to those problems.Much more information about these deep-submicron technologies is packed into this book than in any other book I have found." "This up-to-date book is one of a kind." |
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| "Excellent review on recent semiconductor-processing issues. This book collects the "hot" issues on the very latest deep-submicron (less than 0.18-micron) technologies. It definitely provides a good guideline to anyone who is wondering about what is going on now in the Semiconductor Industry." K.-Y. Byun, Daejon, South Korea |
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| "An intermediate to advanced-level treatment that covers all of the latest critical technqiues of IC manufacturing. It does it in a clearly-written & comprehensive manner. We don't belive anyone else has written a more state-of-the art description that covers these technologies since its publication in 2002."
"During the 2000-downturn hardly any new semiconductor titles were published. Fortunately, Dr. Wolf continued to produce the kind of books we need, even during this bleak-period. His latest groundbreaking text fills a yawning void, and as such, should be eagerly embraced by the process engineering community!" |
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| "This final volume in a set dedicated to advances in semiconductor technologies focuses exclusively on techniques needed to manufacture chips for 0.18-micron (and smaller) generations."
"Among the process technologies described are: copper/low-k, dual-damascene interconnects, high-k gate & DRAM dielectrics, 300-mm wafers, chemical-mechanical polishing (CMP), excimer-laser based DUV lithography, chemically-amplified resists, silicon-germanium (SI:Ge), and silicon-on-insulator (SOI)." |
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| Return to Main Page of Vol. 4 | Return to HOME PAGE of LATTICE PRESS | |
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