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Silicon Processing for the VLSI Era:
Volume-4 - Deep-Submicron Process Technology by Stanley Wolf ©2002 826 pp ISBN: 0-9616721-7-X |
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Here is Dr. Wolf's Trailblazing-Guide to the State-of-the Art
SILICON PROCESSING FOR THE VLSI ERA - Vol. 4 "The Highest Profit-Margins in the Semiconductor Industry are Found at the Leading Edge of Technology ... Let Vol. 4 on Deep-Submicron Processing Take You There!" |
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| Have you been searching for a book on the Advanced IC Production-Technologies of the 21st Century? Look no more! One is finally here!
ICs have evolved below 0.13-µm. New processes have been developed to fabricate such deep-submicron devices. As a Microelectronic Professional, you will need to learn about them. The new Vol. 4 from LATTICE PRESS is the only |
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| "This is the first book written solely on deep-submicron device structures and technology ... Wolf's unique ability is to read the literature & compile relevant information in an understandable format for others. This "integration" of over 900 references into a clear & coherent presentation is the primary-value of Wolf's latest treatise." MRS Bulletin, November 2003 CLICK HERE to Read More Reviews of Vol. 4 |
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CONTENTS: SILICON PROCESSING FOR THE VLSI ERA - Vol. 4
Ch. 1 The Evolution of the Structure of MOSFETs - 16 pp; Ch. 2 300-mm Silicon Wafers - 58 pp; Ch. 3 Gate Dielectrics: Thin Gate Oxides - 70 pp; Ch. 4 High-k Deilectrics - 36 pp; Ch. 5 The Structure of Deep-Submicron MOSFETs - 56 pp; Ch. 6 Deep-Submicron Lithography I: Photoresists - 32 pp; Ch. 7 Deep-Submicron Lithography II: Optics and Hardware - 54 pp; Ch. 8 Chemical-Mechanical Polishing (CMP) - 120 pp; Ch. 9 Shallow-Trench Isolation (STI) - 42 pp; Ch. 10 Silicon-Germanium (Si:Ge) Process Technology - 26 pp; Ch. 11 Silicon-on-Insulator Technology (SOI) - 72 pp; Ch. 12 Multilevel Interconnects for ULSI - 30 pp;Ch. 13 Polycides and Salicides of TiSi2, CoSi2, and NiSi - 36 pp; Ch. 14 Low-k Dielectrics - 42 pp; Ch. 15 Dual-Damascene Interconnects - 40 pp; Ch. 16 Copper Interconnect Process Technology - 76 pp. |
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