Process Integration Silicon Processing for the VLSI Era Vol. 2 Home Page

Silicon Processing for the VLSI Era: Volume 2 - Process Integration by Stanley Wolf ©1990 752pp ISBN: 0-9616721-4-5
Get a Copy of SILICON PROCESSING FOR THE VLSI ERA - Vol. 2 & "Learn How All the Pieces of the Puzzle Fit Together!"
Many other books have been written about the individual process modules of IC fabrication. But none offer what Vol. 2 contains - a thorough, & well-documented presentation about how all of these process steps are linked together - so that modern silicon integrated circuits can be built. This texts covers the process integration issues of all the major IC technologies: NMOS; CMOS, bipolar, BiCMOS, and memory circuits (SRAMs, DRAMs, EEPROMs & FLASH). In addition, fabrication details of isolation-structures, metal-silicon contacts, & multilevel interconnects is described. CLICK HERE to Read More Details About Vol. 2

"Stanley Wolf has undertaken an extremely formidable task, namely the writing of a text solely devoted to Silicon Process Integration" ... "It fills a much-needed void and is recommended for the library of semiconductor process technologists & designers" ... "This text represents an important contribution to the field and should be required reading for the beginning engineer." IEEE Circuits & Devices Magazine, Jan. 1991 CLICK HERE to See More Reviews About Vol. 2

CONTENTS: SILICON PROCESSING FOR THE VLSI ERA: Vol. 2 1. Process Integration for VLSI & ULSI - Intro 2. Isolation Technologies for Integrated Circuits (Includes: LOCOS; Shallow Trench Isolation [STI]; & Silicon-On-Insulator [SOI]) 3. Contact Technology & Local Interconnects for VLSI 4. Multilevel Interconnect Technology for VLSI & ULSI 5. NMOS Devices & NMOS Process Integration 6. CMOS Process Integration (p-Well CMOS; n-Well CMOS; Twin-Well CMOS); Latchup in CMOS; CMOS Isolation Technologies; CMOS Process Sequences 7. Bipolar & BiCMOs Process Integration 8. Semiconductor Memory Process Integration (Includes: SRAMS; DRAMs; ROMs; PROMs; EEPROMs; FLASH Memories; FRAMs) 9. Process Simulation (Includes: 1-D Process Simulators [SUPREM III]; 2-D Process Simulators[SUPREM IV], 2-D Topography & Lithography Simulators; Device Simulators [PISCES]). CLICK HERE to Download the Complete 16-pp Table of Contents - Vol. 2

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