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1. Silicon: Single-Crystal Growth & Wafer Preparation (Includes Data on 300-mm Wafers) 2. Crystalline Defects & Gettering 3. Vacuum Technology for ULSI Applications 4. Basics of Thin Films 5. Contamination Control & Cleaning Technology for ULSI 6. Chemical Vapor Deposition (CVD) of Amorphous & Polycrystalline Films (Includes; Polysilicon, CVD-Oxides, Silicon Nitride, Tungsten, Tungsten Silicide, TiN) 7 Silicon Epitaxial Growth & Silicon-on-Insulator (SOI) 8. Thermal Oxidation of Single-Crystal Silicon 9. Diffusion in Silicon (Includes Transient-Enhanced Diffusion [TED]) 10. Ion Implantation for ULSI (Includes Low-Energy & High Energy Ion Implantation) 11. Aluminum Thin Films & Physical Vapor Deposition in ULSI (Includes Collimated Sputtering & Ionized Magnetron Sputter Deposition) 12. Lithography I: Optical Photoresist & Process Technology (Includes DUV Resists, Chemically-Amplified Resists, Anti-Reflective Coatings, Photoresist Processing and Wafer Tracks) 13. Lithography II: Optical Aligners & Photomasks (Includes: Basic Optics for Lithography, Diffraction, Numerical Aperture, Resolution, Resolution-Enhancement Techniques [Off-Axis Illumination, Phase-Shift Masking - PSM, Optical Proximity Correction - OPC], Pattern Registration, Optical Lithography Exposure Systems (Excimer DUV Lasers, Step-&-Scan Projection Systems, Alignment Systems in Steppers, Mechanical Aspects of Stepper Wafer Stages), Mask & Reticle Fabrication, Pellicles, Limits of Optical Lithography, SCALPEL, EUV. 14. Dry Etching for ULSI (Includes High-Density Plasma Sources) 15. Multilevel Interconnects for ULSI (Includes: Chemical-Mechanical Polishing (CMP); Copper Interconnects (Cu), Dual-Damascene Interconnects, Low-k Dielectrics, Spin-On-Glass) 16. CMOS Process Ingration (Includes Process-Flow of 1.0 micron CMOS Technolgy & Process-Flow for 0.25 micron CMOS Technology 17. Assembly & Packaging for ULSI.
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