"Although the book contains a plethora of useful information on PVD, it has, in my opinoin, one significant drawback. That is, "Sputtering" is the main PVD process used in VLSI & ULSI fabrication. However, Mattox devotes only one chapter (50 pages long) of this 900+ page book specifically to this subject. Although it contains many useful discussions on practical sputtering process issues (e.g., sputtering target shielding, cooling, & conditioning, contamination from arcing, contamination from processing gases, backing plates & bonding), the chapter contains scant coverage of many of the latest developments in sputtering (i.e., collimators, ionized magnetron sputtering, and Cu sputtering). The chapter also fails to describe (or even mention) the Applied Materials Endura sputtering tool - which has captured over 75 % of the market share for sputter-deposition onto 200-mm wafers. (Our SILICON PROCESSING FOR THE VLSI ERA: Vol. 1 - Process Technology 2nd Edition, has far more coverage on this aspect of Sputtering than does Mattox.) Despite these limitations, the background information and practical tips make this a valuable reference text."