HANDBOOK OF
SEMICONDUCTOR MANUFACTURING TECHNOLOGY
Editors: Y. Nishi & R. Doering
© 2000 1158 pp. $195.00
TABLE OF CONTENTS OF THE CHAPTERS THAT DEAL WITH IC MANUFACTURING ISSUES
(Note that there also 14 other chapters that deal with IC Process Technology topics.)

1. Overview of Process Control 2. In-Line Metrology 3. In-Situ Metrology 4. Yield Modeling 5. Yield Management 6. Electrical, Physical, and Chemical Characterization 7. Failure Analysis 8. Reliability Physics 9. Chip Testing 10. Assembly
and Packaging 11. Environment, Safety, & Health Issues 12. Wafer Fabrication Facilities 13. Wafer Logistics and Automated Material Handling Systems 14. Factory Modeling 15. Economics of Semiconductor Manufacturing 16. Introduction to Semiconductor Equipment 17. Semiconductor Equipment Reliability 18. Mask Making for Microlithography
Dr. Wolf's REVIEW
"This "HANDBOOK" is a huge tome, having over 1150 pages and weighing more than 6 lb. It consists of 37 chapters, each written by a separate group of authors. About half of the chapters deal with individual process modules (e.g., oxidation, ion implantation, lithography) and the other half covers semiconductor manufacturing subjects. The 550+ pages on IC manufacturing topics are not covered in the SILICON PROCESSING Series. This makes the "Handbook" an excellent complement to the 4 Lattice Press SILICON PROCESSING texts. Since the HANDBOOK was published in 2000, it also has the latest information on these ULSI manufacturing subjects. Some of the unique coverage it provides deals with the topics of wafer-fabrication facilities, economics of IC fabrication, automated wafer-handling and wafer-tracking during production, and process-control issues."
PRICE: $195.00

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