PREFACE
Chap. 1 - The Semiconductor Industry 1
Chap. 2 - Semiconductors & Basic Materials Science 15
Chap. 3 - Semiconductor Devices & Integrated-Circuit Types 33
Chap. 4 - Overview of Semiconductor Manufacturing 51
Chap. 5 - Gases, Liquid Chemicals, & Ultrapure Water 73
Chap. 6 - Vacuum Technology for ULSI Applications 87
Chap. 7 - The Basics of Thin-Films 111
Chap. 8 - Contamination Control & Cleaning Technology for ULSI 121
Chap. 9 - Silicon: Single-Crystal Growth 145
Chap. 10 - Wafer Production: From Ingot to Finished Wafer 163
Chap. 11 - Diffusion 175
Chap. 12 - Ion Implantation 189
Chap. 13 - Oxidation 213
Chap. 14 - Plasmas Used in Microchip Manufacturing 237
Chap. 15 - Aluminum Thin Films & Sputter Deposition for ULSI 247
Chap. 16 - Chemical Vapor Deposition of Amorphous & Poly Films 269
Chap. 17 - Silicon Epitaxy & Silicon-on-Insulator 305
Chap. 18 - Lithography I: Photoresist Materials & Processing 321
Chap. 19 - Lithography II: Image Formation & Optical Hardware 341
Chap. 20 - Lithography III: Photomasks & Next-Generation Litho 359
Chap. 21 - Terminology of Etching & Wet-Chemical Etching 381
Chap. 22 - Dry Etching for ULSI 391
Chap. 23 - Chemical Mechanical Polishing (CMP) 417
Chap. 24 - Interconnects: Cu, Low-k Dielectric, Dual Damascene 437
Chap. 25 - Materials Characterization Techniques 455
Chap. 26 - Wafer & Chip Testing 475
Chap. 27 - Assembly & Packaging 483
Chap. 28 - Wafer-Fab Operations & Yield 503
Chap. 29 - Environmental, Health, & safety Issues 517
Appendices 529
INDEX 553