MICROCHIP MANUFACTURING is the first FULL-COLOR title ever, on semiconductor manufacturing, with over 800 color illustrations in its 562 pages.

Ch. 1 The Microchip Manufacturing Industry; Ch. 2 Semiconductors & Basic Materials Science; Ch. 3 Semiconductor Devices & Integrated Circuit Types; Ch. 4 Overview of Semiconductor Manufacturing: CMOS Process-Flow; Ch. 5 Gases, Liquids, & Ultra-Pure Water for ULSI; Ch. 6 Vacuum Technology for ULSI Applications; Ch. 7 Basics of Thin Films; Ch. 8 Contamination Control & Cleaning Technology for ULSI; Ch. 9 Silicon: Single-Crystal Growth; Ch. 10 Silicon Wafer Production: From Ingot to Finished Wafer; Ch. 11 Diffusion; Ch. 12 Ion Implantation; Ch. 13 Oxidation; Ch. 14 Plasmas Used in Microchip Manufacturing; Ch. 15 Aluminum Thin-Films & Sputter-Deposition in ULSI; Ch. 16 CVD of Amorphous & Polycrystalline Films; Ch. 17 Silicon Epitaxy & Silicon-on-Insulator; Ch. 18 Lithography I: Photoresist Materials & Processing; Ch. 19 Lithography II: Image Formation & Optical Hardware; Ch. 20 Lithography III: Photomasks & Next-Generation Lithography; Ch. 21 Terminology of Wet-Etching Technology; Ch. 22 Dry-Etching for ULSI; Ch. 23 Chemical-Mechanical Polishing (CMP);
Ch. 24 Multi-Level Interconnects: Copper, Low-k Dielectrics, & Dual-Damascene Structures; Ch. 25 Materials Characterization Techniques; Ch. 26 Wafer & Chip Testing; Ch. 27 Assembly & Packaging for ULSI; Ch. 28 Microchip Manufacturing Fab Operations & Yield; Ch. 29 Environmental, Health, & Safety Issues in Microchip Manufacturing; Appendices.
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MICROCHIP MANUFACTURING is not only the newest book on the subject (©2004), but is also a more introductory treatment than the 4-Volume SILICON PROCESSING FOR THE VLSI Series.
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It should especially appeal to those peripherally involved in silicon technology, but who would like an overall perspective of microchip manufacturing methods.

Such Microelectronic Professionals include: IC Designers; Test & Product Engineers; Quality & Reliability Personnel; Technicans & Field-Service Staff; Marketing, Communications, & Sales Representatives; IP Lawyers; Technical Professionals working for Firms that provide Equipment, Materials, & Services to Wafer Fabs. The Contents of its 29 chapters are given below.
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